Issued Patents All Time
Showing 25 most recent of 45 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8049342 | Semiconductor device and method of fabrication thereof | Jerry M. Brooks, David J. Corisis | 2011-11-01 |
| 7998792 | Semiconductor device assemblies, electronic devices including the same and assembly methods | Jerry M. Brooks, David J. Corisis | 2011-08-16 |
| 7999378 | Semiconductor devices including semiconductor dice in laterally offset stacked arrangement | Jerry M. Brooks, David J. Corisis | 2011-08-16 |
| 7829991 | Stackable ceramic FBGA for high thermal applications | Walter L. Moden, David J. Corisis, Larry D. Kinsman | 2010-11-09 |
| 7704794 | Method of forming a semiconductor device | Jerry M. Brooks, David J. Corisis | 2010-04-27 |
| 7408255 | Assembly for stacked BGA packages | David J. Corisis, Walter L. Moden, Larry D. Kinsman | 2008-08-05 |
| 7400032 | Module assembly for stacked BGA packages | David J. Corisis, Walter L. Moden, Larry D. Kinsman | 2008-07-15 |
| 7396702 | Module assembly and method for stacked BGA packages | David J. Corisis, Walter L. Moden, Larry D. Kinsman | 2008-07-08 |
| 7375419 | Stacked mass storage flash memory package | Jerry M. Brooks, David J. Corisis | 2008-05-20 |
| 7285442 | Stackable ceramic FBGA for high thermal applications | Walter L. Moden, David J. Corisis, Larry D. Kinsman | 2007-10-23 |
| 7279797 | Module assembly and method for stacked BGA packages | David J. Corisis, Walter L. Moden, Larry D. Kinsman | 2007-10-09 |
| 7262506 | Stacked mass storage flash memory package | Jerry M. Brooks, David J. Corisis | 2007-08-28 |
| 7229905 | Alignment and orientation features for a semiconductor package | Stuart L. Roberts, William Reeder | 2007-06-12 |
| 7166252 | Method for reducing warpage during application and curing of encapsulant materials on a printed circuit board | Derek Gochnour | 2007-01-23 |
| 6900528 | Stacked mass storage flash memory package | Jerry M. Brooks, David J. Corisis | 2005-05-31 |
| 6869869 | Alignment and orientation features for a semiconductor package | Stuart L. Roberts, William Reeder | 2005-03-22 |
| 6864700 | System for electronically coupling a device to an electrical apparatus | — | 2005-03-08 |
| 6858926 | Stackable ceramic FBGA for high thermal applications | Walter L. Moden, David J. Corisis, Larry D. Kinsman | 2005-02-22 |
| 6838768 | Module assembly for stacked BGA packages | David J. Corisis, Walter L. Moden, Larry D. Kinsman | 2005-01-04 |
| 6830719 | Method for reducing warpage during application and curing of encapsulant materials on a printed circuit board | Derek Gochnour | 2004-12-14 |
| 6815261 | Encapsulation method in a molding machine for an electronic device | — | 2004-11-09 |
| 6777965 | Interposer for electrically coupling a semiconductive device to an electrical apparatus | — | 2004-08-17 |
| 6764549 | Method and apparatus for reducing warpage during application and curing of encapsulant materials on a printed circuit board | Derek Gochnour | 2004-07-20 |
| 6760224 | Heat sink with alignment and retaining features | Walter L. Moden, David J. Corisis, Larry D. Kinsman | 2004-07-06 |
| 6690188 | Method of testing a semiconductor device | — | 2004-02-10 |