| 9281300 |
Chip scale module package in BGA semiconductor package |
Emmanuel Espiritu, Dario S. Filoteo, Jr., Rachel Layda Abinan |
2016-03-08 |
| 8395254 |
Integrated circuit package system with heatspreader |
Emmanuel Espiritu, Dario S. Filoteo, Jr., Philip Lyndon Cablao, Rachel Layda Abinan, Allan P. Ilagan |
2013-03-12 |
| 8138080 |
Integrated circuit package system having interconnect stack and external interconnect |
Dario S. Filoteo, Jr., Philip Lyndon Cablao, Emmanuel Espiritu, Rachel Layda Abinan, Allan P. Ilagan |
2012-03-20 |
| 8097496 |
Method of forming quad flat package |
Emmanuel Espiritu, Rachel Layda Abinan, Dario S. Filoteo, Jr. |
2012-01-17 |
| 8097935 |
Quad flat package |
Emmanuel Espiritu, Rachel Layda Abinan, Dario S. Filoteo, Jr. |
2012-01-17 |
| 8026129 |
Stacked integrated circuits package system with passive components |
Philip Lyndon Cablao, Dario S. Filoteo, Jr., Emmanuel Espiritu, Rachel Layda Abinan, Allan P. Ilagan |
2011-09-27 |
| 7786575 |
Stacked die semiconductor device having circuit tape |
Philip Lyndon Cablao, Dario S. Filoteo, Jr., Emmanuel Espiritu |
2010-08-31 |
| 7687892 |
Quad flat package |
Emmanuel Espiritu, Rachel Layda Abinan, Dario S. Filoteo, Jr. |
2010-03-30 |
| 7659608 |
Stacked die semiconductor device having circuit tape |
Philip Lyndon Cablao, Dario S. Filoteo, Jr., Emmanuel Espiritu |
2010-02-09 |
| 7439620 |
Integrated circuit package-in-package system |
Emmanuel Espiritu, Philip Lyndon Cablao, Dario S. Filoteo, Jr. |
2008-10-21 |
| 6875634 |
Heat spreader anchoring and grounding method and thermally enhanced PBGA package using the same |
Il Kwon Shim, Hermes T. Apale, Weddie Aquien, Dario S. Filoteo, Jr., Virgil Ararao |
2005-04-05 |
| 6737298 |
Heat spreader anchoring & grounding method & thermally enhanced PBGA package using the same |
Il Kwon Shim, Hermes T. Apale, Weddle Aquien, Dario S. Filoteo, Jr., Virgil Ararao |
2004-05-18 |