Issued Patents All Time
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12406951 | Redistribution layer having a sideview zig-zag profile | Yufu Liu, Tsung Nan Lo, Wen-Hung Huang | 2025-09-02 |
| 12387985 | Semiconductor device with cavity carrier and method therefor | Zhiwei Gong, Neil T. Tracht | 2025-08-12 |
| 12288770 | Semiconductor packages with embedded wiring on re-distributed bumps | Norazham Mohd Sukemi, Chin Teck Siong, Tsung Nan Lo, Wen-Hung Huang | 2025-04-29 |
| 12198998 | Dielectric sidewall protection and sealing for semiconductor devices in a in wafer level packaging process | Che Ming Fang, Yufu Liu, Wen-Hung Huang | 2025-01-14 |
| 12080601 | Packaged semiconductor devices and methods therefor | Wen-Hung Huang, Yufu Liu | 2024-09-03 |
| 11935753 | Backside and sidewall metallization of semiconductor devices | Wen-Hung Huang, Che Ming Fang, Yufu Liu | 2024-03-19 |
| 11640947 | Pre-resist island forming via method and apparatus | Wen-Hung Huang, Che Ming Fang, Yufu Liu | 2023-05-02 |