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Transfer board |
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2021-02-02 |
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Multi-sensor tiled camera with flexible electronics for wafer inspection |
Pablo Pombo |
2020-07-28 |
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Integrated multi-channel analog front end and digitizer for high speed imaging applications |
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Methods and systems for monitoring a parameter of a measurement device during polishing, damage to a specimen during polishing, or a characteristic of a polishing pad or tool |
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Integrated multi-channel analog front end and digitizer for high speed imaging applications |
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Methods and systems for monitoring a parameter of a measurement device during polishing, damage to a specimen during polishing, or a characteristic of a polishing pad or tool |
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Methods and systems for monitoring a parameter of a measurement device during polishing, damage to a specimen during polishing, or a characteristic of a polishing pad or tool |
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2008-02-19 |
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Methods and systems for determining a characteristic of polishing within a zone on a specimen from combined output signals of an eddy current device |
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2007-02-13 |
| 7096752 |
Environmental damage reduction |
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2006-08-29 |
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In-situ metalization monitoring using eddy current measurements during the process for removing the film |
Shing Lee, Walter H. Johnson, John Fielden |
2006-07-04 |
| 7052369 |
Methods and systems for detecting a presence of blobs on a specimen during a polishing process |
Charles Chen, Ronald L. Allen, Robert Shinagawa, Anantha R. Sethuraman, Christopher F. Bevis +3 more |
2006-05-30 |
| 7030018 |
Methods and systems for monitoring a parameter of a measurement device during polishing, damage to a specimen during polishing, or a characteristic of a polishing pad or tool |
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2006-04-18 |
| 6935922 |
Methods and systems for generating a two-dimensional map of a characteristic at relative or absolute locations of measurement spots on a specimen during polishing |
Charles Chen, Ronald L. Allen, Robert Shinagawa, Anantha R. Sethuraman, Christopher F. Bevis +3 more |
2005-08-30 |
| 6885190 |
In-situ metalization monitoring using eddy current measurements during the process for removing the film |
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2005-04-26 |
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Systems and methods for characterizing a polishing process |
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2005-04-26 |
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Windows configurable to be coupled to a process tool or to be disposed within an opening in a polishing pad |
Charles Chen, Ronald L. Allen, Robert Shinagawa, Anantha R. Sethuraman, Christopher F. Bevis +3 more |
2005-03-15 |
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In-situ metalization monitoring using eddy current and optical measurements |
Shing Lee, Walter H. Johnson, John Fielden, Guoheng Zhao, Mehrdad Nikoonahad |
2004-03-16 |
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Apparatus and methods for performing self-clearing optical measurements |
Mehrdad Nikoonahad, Shing Lee, Kalman Kele, Guoheng Zhao |
2003-09-30 |
| 6621264 |
In-situ metalization monitoring using eddy current measurements during the process for removing the film |
Shing Lee, Walter H. Johnson, John Fielden |
2003-09-16 |
| 6433541 |
In-situ metalization monitoring using eddy current measurements during the process for removing the film |
Shing Lee, Walter H. Johnson, John Fielden |
2002-08-13 |
| 5552704 |
Eddy current test method and apparatus for measuring conductance by determining intersection of lift-off and selected curves |
Chester L. Mallory, Walter H. Johnson |
1996-09-03 |