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Methods and apparatus for using structural elements to improve drop/shock resilience in semiconductor devices |
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Two-step solder-mask-defined design |
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| 12218079 |
Semiconductor devices with reinforced substrates |
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| 12211814 |
Semiconductor interconnect structures with conductive elements, and associated systems and methods |
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| 12211822 |
Stacked semiconductor die assemblies with substrate heat sinks and associated systems and methods |
Shams U. Arifeen, Christopher Glancey |
2025-01-28 |
| 11908803 |
Semiconductor devices with flexible connector array |
Xiaopeng Qu |
2024-02-20 |
| 11869862 |
Microelectronic components including metal pillars secured to bond pads, and related methods, assemblies, and systems |
Shams U. Arifeen, Christopher Glancey |
2024-01-09 |
| 11769752 |
Stacked semiconductor die assemblies with substrate heat sinks and associated systems and methods |
Shams U. Arifeen, Christopher Glancey |
2023-09-26 |
| 11728307 |
Semiconductor interconnect structures with conductive elements, and associated systems and methods |
Shams U. Arifeen, Quang Nguyen, Christopher Glancey, Chan H. Yoo |
2023-08-15 |
| 11664360 |
Circuit board with spaces for embedding components |
Quang Nguyen, Christopher Glancey, Shams U. Arifeen |
2023-05-30 |
| 11646286 |
Processes for forming self-healing solder joints and repair of same, related solder joints, and microelectronic components, assemblies and electronic systems incorporating such solder joints |
Shams U. Arifeen, Christopher Glancey, Xiao Li |
2023-05-09 |
| 11552029 |
Semiconductor devices with reinforced substrates |
Shams U. Arifeen, Christopher Glancey |
2023-01-10 |
| 11348875 |
Semiconductor devices with flexible connector array |
Xiaopeng Qu |
2022-05-31 |
| 11276659 |
Methods for forming elements for microelectronic components, related conductive elements, and microelectronic components, assemblies and electronic systems incorporating such conductive elements |
Shams U. Arifeen, Christopher Glancey |
2022-03-15 |
| 11207744 |
Two-step solder-mask-defined design |
Hyunsuk Chun |
2021-12-28 |