Issued Patents All Time
Showing 1–17 of 17 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12028986 | Mounting method and mounting structure formed by the same | Naomichi Ohashi, Yasuhiro OKAWA | 2024-07-02 |
| 11970631 | Conductive paste and conductive film formed using the same | Naomichi Ohashi | 2024-04-30 |
| 11822168 | Photocurable composition and liquid crystal display device | Keisuke Kawashima | 2023-11-21 |
| 11623307 | Resin flux solder paste and mount structure | HIROHISA HINO | 2023-04-11 |
| 11618110 | Solder paste and mounting structure | Naomichi Ohashi, Yasuhiro OKAWA | 2023-04-04 |
| 11053328 | Photocurable composition | Keisuke Kawashima | 2021-07-06 |
| 8992726 | Method and device for peeling off silicon wafers | Michirou Yoshino, Masayuki Takahashi, Tooru Furushige, Yuji Yamamoto | 2015-03-31 |
| 8867228 | Electrode bonding structure, and manufacturing method for electrode bonding structure | Hiroaki Katsura, Yoji Ueda | 2014-10-21 |
| 8482931 | Package structure | Ryo Kuwabara, Atsushi Yamaguchi, Hidenori Miyakawa | 2013-07-09 |
| 8410377 | Mounted structure | Atsushi Yamaguchi, Hidenori Miyakawa, Shigeaki Sakatani | 2013-04-02 |
| 8378472 | Mounting structure for semiconductor element with underfill resin | Atsushi Yamaguchi, Shigeaki Sakatani, Hidenori Miyakawa, Mikiya Ueda | 2013-02-19 |
| 8344268 | Electronic component packaging structure having two-layer moisture-proof coating and method for manufacturing the same | Hideyuki Tsujimura, Hidenori Miyakawa, Atsushi Yamaguchi, Hiroe Kowada | 2013-01-01 |
| 8345444 | Structure with electronic component mounted therein and method for manufacturing such structure | Shigeaki Sakatani, Atsushi Yamaguchi, Hidenori Miyakawa, Mikiya Ueda | 2013-01-01 |
| 8319108 | Mounting structure and electronic equipment | Atsushi Yamaguchi, Ryo Kuwabara, Hiroe Kowada, Kimiaki Nakaya | 2012-11-27 |
| 8179686 | Mounted structural body and method of manufacturing the same | Shigeaki Sakatani, Atsushi Yamaguchi, Hidenori Miyakawa | 2012-05-15 |
| 8138426 | Mounting structure | Hidenori Miyakawa, Shigeaki Sakatani | 2012-03-20 |
| 7785500 | Electrically conductive adhesive | Atsushi Yamaguchi, Hidenori Miyakawa, Takayuki Higuchi, Hideyuki Tsujimura | 2010-08-31 |