Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 8867228 | Electrode bonding structure, and manufacturing method for electrode bonding structure | Koso Matsuno, Yoji Ueda | 2014-10-21 | |
| 7852102 | Method and apparatus for inspecting semiconductor device | Hiroki Kitagawa | 2010-12-14 | $96,000 |
| 7793546 | Ultrasonic flaw detection method and ultrasonic flaw detection device | Yoichiro Ueda, Kazuya Ushirokawa | 2010-09-14 | $88,000 |