Issued Patents All Time
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7241372 | Plating apparatus and plating liquid removing method | Satoshi Sendai, Katsumi Tsuda | 2007-07-10 |
| 7166204 | Plating apparatus and method | Satoshi Sendai, Katsumi Tsuda, Masayuki Kumekawa, Koji Mishima | 2007-01-23 |
| 6689216 | Plating apparatus and plating liquid removing method | Satoshi Sendai, Katsumi Tsuda | 2004-02-10 |
| 6660139 | Plating apparatus and method | Satoshi Sendai, Katsumi Tsuda, Naomitsu Ozawa | 2003-12-09 |
| 6558518 | Method and apparatus for plating substrate and plating facility | Satoshi Sendai, Akihisa Hongo, Katsumi Tsuda, Masayuki Kumekawa, Naoaki Ogure +1 more | 2003-05-06 |
| 6500317 | Plating apparatus for detecting the conductivity between plating contacts on a substrate | Junichiro Yoshioka, Satoshi Sendai, Atsushi Chono, Mitsuo Tada, Akihisa Hongo +4 more | 2002-12-31 |
| 6365020 | Wafer plating jig | Junichiro Yoshioka, Satoshi Sendai, Atsushi Chono, Naomitsu Ozawa | 2002-04-02 |