| 8198140 |
Wiring substrate for mounting semiconductors, method of manufacturing the same, and semiconductor package |
Hideya Murai, Tadanori Shimoto, Takuo Funaya, Katsumi Kikuchi, Shintaro Yamamichi +4 more |
2012-06-12 |
| 7816782 |
Wiring substrate for mounting semiconductors, method of manufacturing the same, and semiconductor package |
Hideya Murai, Tadanori Shimoto, Takuo Funaya, Katsumi Kikuchi, Shintaro Yamamichi +4 more |
2010-10-19 |
| 7566834 |
Wiring board and semiconductor package using the same |
Tadanori Shimoto, Katsumi Kikuchi, Hideya Murai, Kazuhiro Baba, Hirokazu Honda |
2009-07-28 |
| 7397000 |
Wiring board and semiconductor package using the same |
Tadanori Shimoto, Katsumi Kikuchi, Hideya Murai, Kazuhiro Baba, Hirokazu Honda |
2008-07-08 |
| 7233066 |
Multilayer wiring substrate, and method of producing same |
Hirokazu Honda, Kazuhiro Baba, Tadanori Shimoto, Katsumi Kikuchi, Rokuro Kambe +2 more |
2007-06-19 |
| RE39603 |
Process for manufacturing semiconductor device and semiconductor wafer |
Shinichi Chikaki |
2007-05-01 |
| 7060604 |
Multilayer wiring substrate, and method of producing same |
Hirokazu Honda, Kazuhiro Baba, Tadanori Shimoto, Katsumi Kikuchi, Rokuro Kambe +2 more |
2006-06-13 |
| 6339337 |
Method for inspecting semiconductor chip bonding pads using infrared rays |
Shuichi Matsuda, Ryoji Sato, Masaharu Sato |
2002-01-15 |
| 6201298 |
Semiconductor device using wiring tape |
Ryoji Sato, Masanori Takeuchi |
2001-03-13 |
| 6114754 |
Tape automated bonding film |
— |
2000-09-05 |
| 5977617 |
Semiconductor device having multilayer film carrier |
— |
1999-11-02 |
| 5905303 |
Method for manufacturing bump leaded film carrier type semiconductor device |
Shuichi Matsuda, Eiji Hagimoto |
1999-05-18 |
| 5897337 |
Process for adhesively bonding a semiconductor chip to a carrier film |
Shuichi Matsuda |
1999-04-27 |
| 5844304 |
Process for manufacturing semiconductor device and semiconductor wafer |
Shinichi Chikaki |
1998-12-01 |
| 5759873 |
Method of manufacturing chip-size package-type semiconductor device |
Shuichi Matsuda, Hironori Ono |
1998-06-02 |
| 5757068 |
Carrier film with peripheral slits |
Shuichi Matsuda |
1998-05-26 |
| 5726489 |
Film carrier semiconductor device |
Shuichi Matsuda |
1998-03-10 |
| 5683942 |
Method for manufacturing bump leaded film carrier type semiconductor device |
Shuichi Matsuda, Eiji Hagimoto |
1997-11-04 |
| 5292574 |
Ceramic substrate having wiring of silver series |
Yuzo Shimada |
1994-03-08 |
| 5283081 |
Process for manufacturing a ceramic wiring substrate having a low dielectric constant |
Yoshinobu Kobayashi, Yuzo Shimada |
1994-02-01 |
| 5283210 |
Low temperature sintering low dielectric inorganic composition |
Yuzo Shimada |
1994-02-01 |
