Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7271084 | Reinforced solder bump structure and method for forming a reinforced solder bump | Se-Young Jeong, Nam-Seog Kim, Oh-se Yong, Soon-Bum Kim, Sun Young Park +1 more | 2007-09-18 |
| 7015590 | Reinforced solder bump structure and method for forming a reinforced solder bump | Se-Young Jeong, Nam-Seog Kim, Oh-se Yong, Soon-Bum Kim, Sun Young Park +1 more | 2006-03-21 |
| 6878570 | Thin stacked package and manufacturing method thereof | Kwan-Jai Lee, Tae-Je Cho | 2005-04-12 |
| 6849949 | Thin stacked package | Kwan-Jai Lee, Tae-Je Cho | 2005-02-01 |