Issued Patents All Time
Showing 1–25 of 43 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12137558 | Staircase structure for memory device | Zhenyu Lu, Jun Chen, Xiaowang Dai, Qian Tao, Yu Ru Huang +6 more | 2024-11-05 |
| 12063780 | Memory cell structure of a three-dimensional memory device | Xiaowang Dai, Zhenyu Lu, Jun Chen, Qian Tao, Yushi Hu +4 more | 2024-08-13 |
| 12010838 | Staircase structure for memory device | Zhenyu Lu, Jun Chen, Xiaowang Dai, Qian Tao, Yu Ru Huang +6 more | 2024-06-11 |
| 11996322 | Method for forming lead wires in hybrid-bonded semiconductor devices | Meng Yan, Si Ping Hu | 2024-05-28 |
| 11991880 | Three-dimensional memory devices and fabricating methods thereof | Zhenyu Lu, Yu Ru Huang, Qian Tao, Yushi Hu, Jun Chen +3 more | 2024-05-21 |
| 11805646 | Three-dimensional memory devices and methods for forming the same | Zhenyu Lu, Jun Chen, Yushi Hu, Qian Tao, Simon Shi-Ning Yang +1 more | 2023-10-31 |
| 11791265 | Method for forming three-dimensional integrated wiring structure and semiconductor structure thereof | Jun Chen, Si Ping Hu, Zhenyu Lu | 2023-10-17 |
| 11699657 | Three-dimensional memory devices having a plurality of NAND strings located between a substrate and a single crystalline silicon layer | Zhenyu Lu, Jun Chen, Yushi Hu, Qian Tao, Simon Shi-Ning Yang +1 more | 2023-07-11 |
| 11670543 | Method for forming lead wires in hybrid-bonded semiconductor devices | Meng Yan, Si Ping Hu | 2023-06-06 |
| 11462503 | Hybrid bonding using dummy bonding contacts | Tao Wang, Si Ping Hu, Jia Wen Wang, Shi Qi Huang, Jun Chen +1 more | 2022-10-04 |
| 11462474 | Three-dimensional memory devices having a plurality of NAND strings | Zhenyu Lu, Jun Chen, Yushi Hu, Qian Tao, Simon Shi-Ning Yang +1 more | 2022-10-04 |
| 11430756 | Bonded semiconductor structures having bonding contacts made of indiffusible conductive materials and methods for forming the same | Zongliang Huo, Jun Liu, Jun Chen, Zi Qun Hua, Li Xiao | 2022-08-30 |
| 11322392 | Method for forming lead wires in hybrid-bonded semiconductor devices | Meng Yan, Si Ping Hu | 2022-05-03 |
| 11276642 | Method for forming three-dimensional integrated wiring structure and semiconductor structure thereof | Jun Chen, Si Ping Hu, Zhenyu Lu | 2022-03-15 |
| 11211397 | Three-dimensional memory devices and methods for forming the same | Zhenyu Lu, Jun Chen, Yushi Hu, Qian Tao, Simon Shi-Ning Yang +1 more | 2021-12-28 |
| 11205619 | Hybrid bonding using dummy bonding contacts and dummy interconnects | Tao Wang, Si Ping Hu, Jia Wen Wang, Shi Qi Huang, Jun Chen +1 more | 2021-12-21 |
| 11145666 | Staircase structure for memory device | Zhenyu Lu, Jun Chen, Xiaowang Dai, Qian Tao, Yu Ru Huang +6 more | 2021-10-12 |
| 11133325 | Memory cell structure of a three-dimensional memory device | Xiaowang Dai, Zhenyu Lu, Jun Chen, Qian Tao, Yushi Hu +4 more | 2021-09-28 |
| 11101276 | Word line contact structure for three-dimensional memory devices and fabrication methods thereof | Zhenyu Lu, Jun Chen, Si Ping Hu, Xiaowang Dai, Lan Yao +4 more | 2021-08-24 |
| 11056387 | Method for forming three-dimensional integrated wiring structure and semiconductor structure thereof | Jun Chen, Si Ping Hu, Zhenyu Lu | 2021-07-06 |
| 11049834 | Hybrid bonding using dummy bonding contacts | Tao Wang, Si Ping Hu, Jia Wen Wang, Shi Qi Huang, Jun Chen +1 more | 2021-06-29 |
| 11031333 | Three-dimensional memory devices having a plurality of NAND strings | Zhenyu Lu, Jun Chen, Yushi Hu, Qian Tao, Simon Shi-Ning Yang +1 more | 2021-06-08 |
| 10867678 | Three-dimensional memory devices | Jun Chen, Zhenyu Lu, Yushi Hu, Jin Wen Dong, Lan Yao | 2020-12-15 |
| 10847528 | Memory cell structure of a three-dimensional memory device | Xiaowang Dai, Zhenyu Lu, Jun Chen, Qian Tao, Yushi Hu +4 more | 2020-11-24 |
| 10840125 | Memory structure and method for forming the same | Jin Wen Dong, Jun Chen, Zhiliang Xia, Zi Qun Hua, He Chen | 2020-11-17 |