JD

Jean Dery

IBM: 5 patents #18,733 of 70,183Top 30%
AA Ascom Autelca Ag: 1 patents #7 of 24Top 30%
SE Secap: 1 patents #7 of 11Top 65%
Overall (All Time): #880,767 of 4,157,543Top 25%
6
Patents All Time

Issued Patents All Time

Patent #TitleCo-InventorsDate
6618797 Device and method for protection against stack overflow and franking machine using same Frédéric L'Hote 2003-09-09
6410988 Thermally enhanced and mechanically balanced flip chip package and method of forming David V. Caletka, Eric Duchesne, Michael A. Gaynes, Eric A. Johnson, Luis J. Matienzo +1 more 2002-06-25
6348738 Flip chip assembly Frank D. Egitto, Luis J. Matienzo, Charles Ouellet, Luc Ouellet, David L. Questad +2 more 2002-02-19
6306683 Method of forming a flip chip assembly, and a flip chip assembly formed by the method Frank D. Egitto, Luis J. Matienzo, Charles Ouellet, Luc Ouellet, David L. Questad +2 more 2001-10-23
6104093 Thermally enhanced and mechanically balanced flip chip package and method of forming David V. Caletka, Eric Duchesne, Michael A. Gaynes, Eric A. Johnson, Luis J. Matienzo +1 more 2000-08-15
6074895 Method of forming a flip chip assembly Frank D. Egitto, Luis J. Matienzo, Charles Ouellet, Luc Ouellet, David L. Questad +2 more 2000-06-13