| 7199309 |
Structure for repairing or modifying surface connections on circuit boards |
Bruce J. Chamberlin, Mark K. Hoffmeyer, Wai Mon Ma, Arch Nuttall |
2007-04-03 |
| 7173193 |
Method and structure for implementing enhanced interconnection performance of a land grid array (LGA) module and a printed wiring board |
William L. Brodsky, Mark K. Hoffmeyer |
2007-02-06 |
| 6912780 |
Method and structure for repairing or modifying surface connections on circuit boards |
Bruce J. Chamberlin, Mark K. Hoffmeyer, Wai Mon Ma, Arch Nuttall |
2005-07-05 |
| 6832436 |
Method for forming a substructure of a multilayered laminate |
Donald O. Anstrom, Bruce J. Chamberlin, James W. Fuller, John M. Lauffer, Voya R. Markovich +2 more |
2004-12-21 |
| 6784377 |
Method and structure for repairing or modifying surface connections on circuit boards |
Bruce J. Chamberlin, Mark K. Hoffmeyer, Wai Mon Ma, Arch Nuttall |
2004-08-31 |
| 6593534 |
Printed wiring board structure with z-axis interconnections |
Gerald W. Jones, John M. Lauffer, Voya R. Markovich, Thomas R. Miller, James P. Paoletti +1 more |
2003-07-15 |
| 6576013 |
Eye prosthesis |
Mark Budman |
2003-06-10 |
| 6565367 |
Zero insertion force compliant pin contact and assembly |
Mark Budman, Bruce J. Chamberlin, Li Li |
2003-05-20 |
| 6426466 |
Peripheral power board structure |
Bruce J. Chamberlin, John M. Lauffer |
2002-07-30 |
| 6407341 |
Conductive substructures of a multilayered laminate |
Donald O. Anstrom, Bruce J. Chamberlin, James W. Fuller, John M. Lauffer, Voya R. Markovich +2 more |
2002-06-18 |
| 6232564 |
Printed wiring board wireability enhancement |
Steven F. Arndt, Mark Budman |
2001-05-15 |
| 6150061 |
Clover-leaf solder mask opening |
— |
2000-11-21 |
| 6078013 |
Clover-leaf solder mask opening |
— |
2000-06-20 |
