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Electronic structures including barrier layers and/or oxidation barriers defining lips and related methods |
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Solder structures including barrier layers with nickel and/or copper |
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| 7665652 |
Electronic devices including metallurgy structures for wire and solder bonding |
Kevin Engel |
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| 7547623 |
Methods of forming lead free solder bumps |
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2009-06-16 |
| 7427557 |
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Glenn Rinne |
2008-09-23 |
| 7358174 |
Methods of forming solder bumps on exposed metal pads |
— |
2008-04-15 |
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Methods of forming metallurgy structures for wire and solder bonding |
Kevin Engel |
2004-07-13 |
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Method to reduce stress from trench structure on SOI wafer |
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Multilayered intermetallic connection for semiconductor devices |
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1992-12-15 |
