Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7839000 | Solder structures including barrier layers with nickel and/or copper | J. Daniel Mis, Gretchen Adema, Susan Bumgarner, Pooja Chilukuri, Glenn Rinne | 2010-11-23 |
| 7547623 | Methods of forming lead free solder bumps | J. Daniel Mis, Gretchen Adema, Susan Bumgarner, Pooja Chilukuri, Glenn Rinne | 2009-06-16 |