Issued Patents All Time
Showing 1–20 of 20 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7206044 | Display and solar cell device | Zili Li, Kevin W. Jelley | 2007-04-17 |
| 6829502 | Brain response monitoring apparatus and method | Di-An Hong, Yong Liu, Tom Mathew, Weinin Xiao | 2004-12-07 |
| 6730056 | Eye implant for treating glaucoma and method for manufacturing same | Sanjar Ghaem, Rudyard Istvan | 2004-05-04 |
| 6285899 | Remotely interrogated biomedical sensor | Sanjar Ghaem | 2001-09-04 |
| 6194250 | Low-profile microelectronic package | Cynthia M. Melton, George N. Demet | 2001-02-27 |
| 6049463 | Microelectronic assembly including an antenna element embedded within a polymeric card, and method for forming same | Grace M. O'Malley, Lillian C. Thompson, George Amos Carson | 2000-04-11 |
| 5923796 | Microelectronic module having optical and electrical interconnects | Michael R. Feldman, Gretchen Adema | 1999-07-13 |
| 5844315 | Low-profile microelectronic package | Cynthia M. Melton, George N. Demet | 1998-12-01 |
| 5638469 | Microelectronic module having optical and electrical interconnects | Michael R. Feldman, Gretchen Adema | 1997-06-10 |
| 5447264 | Recessed via apparatus for testing, burn-in, and/or programming of integrated circuit chips, and for placing solder bumps thereon | Nicholas G. Koopman, Glenn Rinne | 1995-09-05 |
| 5381946 | Method of forming differing volume solder bumps | Nicholas G. Koopman, Glenn Rinne, Edward K. Yung | 1995-01-17 |
| 5374893 | Apparatus for testing, burn-in, and/or programming of integrated circuit chips, and for placing solder bumps thereon | Nicholas G. Koopman, Glenn Rinne, Edward K. Yung | 1994-12-20 |
| 5325265 | High performance integrated circuit chip package | Arnold Reisman, Deepak Nayak, Lih-Tyng Hwang, Giora Dishon, Scott Jacobs +2 more | 1994-06-28 |
| 5289631 | Method for testing, burn-in, and/or programming of integrated circuit chips | Nicholas G. Koopman, Glenn Rinne, Edward K. Yung | 1994-03-01 |
| 5237434 | Microelectronic module having optical and electrical interconnects | Michael R. Feldman, Gretchen Adema | 1993-08-17 |
| 5168078 | Method of making high density semiconductor structure | Arnold Reisman | 1992-12-01 |
| 5145714 | Metal-organic chemical vapor deposition for repairing broken lines in microelectronic packages | Arnold Reisman, Dorota Temple | 1992-09-08 |
| 5025304 | High density semiconductor structure and method of making the same | Arnold Reisman | 1991-06-18 |
| 5009360 | Metal-to-metal bonding method and resulting structure | Arnold Reisman, Deepak Nayak | 1991-04-23 |
| 4483541 | Gas seal for semiconductor processing equipment | Tibor F. Devenyi | 1984-11-20 |