Issued Patents All Time
Showing 1–13 of 13 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9616524 | Light induced patterning | Mikhael Matusovsky, Amir Noy, Moshe Finarov | 2017-04-11 |
| 9291911 | Monitoring apparatus and method particularly useful in photolithographically processing substrates | Moshe Finarov, Zvi Nirel, Yoel Cohen | 2016-03-22 |
| 8780320 | Monitoring apparatus and method particularly useful in photolithographically processing substrates | Moshe Finarov, Zvi Nirel, Yoel Cohen | 2014-07-15 |
| 8482715 | Monitoring apparatus and method particularly useful in photolithographically processing substrates | Moshe Finarov, Zvi Nirel, Yoel Cohen | 2013-07-09 |
| 7821614 | Monitoring apparatus and method particularly useful in photolithographically processing substrates | Moshe Finarov, Zvi Nirel, Yoel Cohen | 2010-10-26 |
| 7525634 | Monitoring apparatus and method particularly useful in photolithographically | Moshe Finarov, Zvi Nirel, Yoel Cohen | 2009-04-28 |
| 7289190 | Monitoring apparatus and method particularly useful in photolithographically | Moshe Finarov, Zvi Nirel, Yoel Cohen | 2007-10-30 |
| 7030957 | Monitoring apparatus and method particularly useful in photolithographically processing substrates | Moshe Finarov, Zvi Nirel, Yoel Cohen | 2006-04-18 |
| 6842220 | Monitoring apparatus and method particularly useful in photolithographically processing substrates | Moshe Finarov, Yoel Cohen, Zvi Nirel | 2005-01-11 |
| 6166801 | Monitoring apparatus and method particularly useful in photolithographically processing substrates | Moshe Finarov, Yoel Cohen, Zvi Nirel | 2000-12-26 |
| 5325265 | High performance integrated circuit chip package | Iwona Turlik, Arnold Reisman, Deepak Nayak, Lih-Tyng Hwang, Scott Jacobs +2 more | 1994-06-28 |
| 4950623 | Method of building solder bumps | — | 1990-08-21 |
| 4921157 | Fluxless soldering process | Stephen M. Bobbio | 1990-05-01 |