Issued Patents All Time
Showing 1–15 of 15 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10845297 | Detection of corrosion using dispersed embedded sensors | Scott Goodwin, Mark W. Roberson, John F. Lewis | 2020-11-24 |
| 10418344 | Electronic packages with three-dimensional conductive planes, and methods for fabrication | Erik Paul Vick | 2019-09-17 |
| 10264669 | Flexible electronic assemblies with embedded electronic devices and methods for their fabrication | Jay L. Lewis, Erik Paul Vick, Ethan J.D. Klem | 2019-04-16 |
| 10209175 | Detection of corrosion using dispersed embedded sensors | Scott Goodwin, Mark W. Roberson, John F. Lewis | 2019-02-19 |
| 9881905 | Electronic packages with three-dimensional conductive planes, and methods for fabrication | Eric Paul Vick | 2018-01-30 |
| 9257335 | Electronic devices utilizing contact pads with protrusions and methods for fabrication | Erik Paul Vick, Garry Brian Cunningham | 2016-02-09 |
| 8975753 | Three dimensional interconnect structure and method thereof | Charles Kenneth Williams, Christopher Bower, Dean M. Malta | 2015-03-10 |
| 8866080 | Faraday cup array integrated with a readout IC and method for manufacture thereof | Christopher Bower, Kristin Hedgepath Gilchrist, Brian R. Stoner | 2014-10-21 |
| 8361901 | Die bonding utilizing a patterned adhesion layer | Erik Paul Vick, Dean M. Malta, Matthew R. Lueck | 2013-01-29 |
| 6545329 | High sensitivity polarized-light discriminator device | John Lañnon, David Dausch | 2003-04-08 |
| 6492781 | Closed-loop cold cathode current regulator | William Palmer | 2002-12-10 |
| 6392355 | Closed-loop cold cathode current regulator | William Palmer | 2002-05-21 |
| 6271150 | Methods of raising reflow temperature of glass alloys by thermal treatment in steam, and microelectronic structures formed thereby | Robert T. Croswell, Arnold Reisman, Darrell Simpson, C. Kenneth Williams | 2001-08-07 |
| 5201995 | Alternating cyclic pressure modulation process for selective area deposition | Arnold Reisman | 1993-04-13 |
| 5145714 | Metal-organic chemical vapor deposition for repairing broken lines in microelectronic packages | Arnold Reisman, Iwona Turlik | 1992-09-08 |