Issued Patents All Time
Showing 25 most recent of 28 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12432928 | Vertical transistor, integrated circuitry, method of forming a vertical transistor, and method of forming integrated circuitry | Hung-Wei Liu, Vassil Antonov, Ashonita A. Chavan, Darwin Franseda Fan, Jeffery B. Hull +5 more | 2025-09-30 |
| 12237217 | Methods of exposing conductive Vias of semiconductor devices and related semiconductor devices | Hongqi Li, Anurag Jindal | 2025-02-25 |
| 11923272 | Integrated assemblies and methods of forming integrated assemblies | Zhuo Chen, Darwin Franseda Fan, Kamal Kumar Muthukrishnan | 2024-03-05 |
| 11871582 | Vertical transistor, integrated circuitry, method of forming a vertical transistor, and method of forming integrated circuitry | Hung-Wei Liu, Vassil Antonov, Ashonita A. Chavan, Darwin Franseda Fan, Jeffery B. Hull +5 more | 2024-01-09 |
| 11335626 | Integrated assemblies and methods of forming integrated assemblies | Zhuo Chen, Darwin Franseda Fan, Kamal Kumar Muthukrishnan | 2022-05-17 |
| 11264395 | Vertical transistor, integrated circuitry, method of forming a vertical transistor, and method of forming integrated circuitry | Hung-Wei Liu, Vassil Antonov, Ashonita A. Chavan, Darwin Franseda Fan, Jeffery B. Hull +5 more | 2022-03-01 |
| 11050020 | Methods of forming devices including multi-portion liners | Kyle B. Campbell, Farrell M. Good, Vishwanath Bhat, Kyuchul Chong | 2021-06-29 |
| 10923478 | Reduction of roughness on a sidewall of an opening | Christopher J. Gambee, Devesh Dadhich Shreeram | 2021-02-16 |
| 10879462 | Devices including multi-portion liners | Kyle B. Campbell, Farrell M. Good, Vishwanath Bhat, Kyuchul Chong | 2020-12-29 |
| 10665782 | Methods of forming semiconductor structures including multi-portion liners | Kyle B. Campbell, Farrell M. Good, Vishwanath Bhat, Kyuchul Chong | 2020-05-26 |
| 10658580 | Semiconductor structures including multi-portion liners | Kyle B. Campbell, Farrell M. Good, Vishwanath Bhat, Kyuchul Chong | 2020-05-19 |
| 10249819 | Methods of forming semiconductor structures including multi-portion liners | Kyle B. Campbell, Farrell M. Good, Vishwanath Bhat, Kyuchul Chong | 2019-04-02 |
| 10163655 | Through substrate via liner densification | Jin Lu, Rita J. Klein, Diem Thy N. Tran, Zhiqiang Xie | 2018-12-25 |
| 9761797 | Methods of forming structures | Hyun Sik Kim, Kyle B. Campbell, Kyuchul Chong | 2017-09-12 |
| 9741612 | Semiconductor devices and methods for backside photo alignment | Brandon P. Wirz, Keith E. Ypma, Christopher J. Gambee, Jaspreet S. Gandhi, Kevin M. Dowdle +2 more | 2017-08-22 |
| 9401474 | Methods of forming structures | Hyun Sik Kim, Kyle B. Campbell, Kyuchul Chong | 2016-07-26 |
| 9299663 | Semiconductor devices and methods for backside photo alignment | Brandon P. Wirz, Keith E. Ypma, Christopher J. Gambee, Jaspreet S. Gandhi, Kevin M. Dowdle +2 more | 2016-03-29 |
| 9034752 | Methods of exposing conductive vias of semiconductor devices and associated structures | Hongqi Li, Anurag Jindal | 2015-05-19 |
| 8318578 | Method of forming capacitors | Kevin R. Shea, Brett W. Busch, Farrell M. Good, Vishwanath Bhat | 2012-11-27 |
| 7618874 | Methods of forming capacitors | Kevin R. Shea, Brett W. Busch, Farrell M. Good, Vishwanath Bhat | 2009-11-17 |
| 7396570 | Plasma enhanced chemical vapor deposition method of forming titanium silicide comprising layers | Cem Basceri, Ammar Derraa, Philip Campbell, Gurtej S. Sandhu | 2008-07-08 |
| 7393563 | Plasma enhanced chemical vapor deposition method of forming titanium silicide comprising layers | Cem Basceri, Ammar Derraa, Philip Campbell, Gurtej S. Sandhu | 2008-07-01 |
| 7033642 | Plasma enhanced chemical vapor deposition method of forming a titanium silicide comprising layer | Cem Basceri, Ammar Derraa, Philip Campbell, Gurtej S. Sandhu | 2006-04-25 |
| 6767823 | Plasma enhanced chemical vapor deposition method of forming titanium silicide comprising layers | Cem Basceri, Ammar Derraa, Philip Campbell, Gurtej S. Sandhu | 2004-07-27 |
| 6734051 | Plasma enhanced chemical vapor deposition methods of forming titanium silicide comprising layers over a plurality of semiconductor substrates | Cem Basceri, Ammar Derraa, Philip Campbell, Gurtej S. Sandhu | 2004-05-11 |