HJ

Hyung Jun Jeon

SC Stats Chippac: 8 patents #102 of 425Top 25%
Samsung: 6 patents #19,812 of 75,807Top 30%
LC Ls Industrial Systems Co.: 4 patents #9 of 131Top 7%
NE Nethom: 1 patents #3 of 13Top 25%
Overall (All Time): #229,231 of 4,157,543Top 6%
19
Patents All Time

Issued Patents All Time

Patent #TitleCo-InventorsDate
12266609 Semiconductor device and method for fabricating the same Kwang-Jin Moon, Son-Kwan Hwang 2025-04-01
11728200 Wafer bonding apparatuses Hoe Chul Kim, Seok Ho Kim, Tae-Yeong Kim, Hoon-Joo Na 2023-08-15
10580726 Semiconductor devices and semiconductor packages including the same, and methods of manufacturing the semiconductor devices Jin-ho Chun, Seong Min Son, Kwang-Jin Moon, Jin Ho An, Ho-Jin Lee +1 more 2020-03-03
10153219 Fan out wafer level package type semiconductor package and package on package type semiconductor package including the same Nae-In Lee, Byung-Iyul Park 2018-12-11
9691685 Semiconductor devices and methods of manufacturing the same, and semiconductor packages including the semiconductor devices Kyu-Ha Lee, Jum-Yong Park, Byung-Lyul Park, Ji-Soon Park, Jin Ho An +1 more 2017-06-27
9107143 Apparatus and method for connecting access point in portable terminal Jong Seok Kim 2015-08-11
8742930 Gate system Jin Kuk Hong, Jeong Ki Ryoo, Jae Yul Choo 2014-06-03
8633056 Integrated circuit package system and method of manufacture thereof Tae Keun Lee, Sung-Soo Kim 2014-01-21
8588337 Vector modulator Heon soo Choi, Chang su Choi, Yeong Chan Kim, Jae hwan Im, Jung ki Ruy 2013-11-19
8537881 Method and apparatus for detecting offset signal of transmission leakage signal in RF transceiver Heon soo Choi, Chang su Choi, Yeong Chan Kim 2013-09-17
8451125 Reader based on RFID Jin Kuk Hong, Jeong Ki Ryoo, Jae Yul Choo 2013-05-28
8400229 Vector modulator using time delay and phase shifter Heon soo Choi, Chang su Choi, Yeong Chan Kim, Jae hwan Im, Jin Kuk Hong 2013-03-19
8368200 Shielded stacked integrated circuit packaging system and method of manufacture thereof Ki Youn Jang, Youngmin Kim 2013-02-05
8114771 Semiconductor wafer scale package system Tae Keun Lee, Young Chan Ko 2012-02-14
8018040 Shielded stacked integrated circuit packaging system and method of manufacture thereof Ki Youn Jang, Youngmin Kim 2011-09-13
7741726 Integrated circuit underfill package system Ki Youn Jang, Dae-Wook Yang 2010-06-22
7705475 Integrated circuit package system Tae Keun Lee, Sung-Soo Kim 2010-04-27
7537962 Method of fabricating a shielded stacked integrated circuit package system Ki Youn Jang, Youngmin Kim 2009-05-26
7485502 Integrated circuit underfill package system Ki Youn Jang, Dae-Wook Yang 2009-02-03