Issued Patents All Time
Showing 1–12 of 12 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12020997 | Methods of forming semiconductor device packages having alignment marks on a carrier substrate | Chen-Hua Yu, Sung-Feng Yeh, Ming-Fa Chen, Hsien-Wei Chen, Ching-Pin Yuan | 2024-06-25 |
| 11721598 | Method of forming semiconductor device package having testing pads on an upper die | Chen-Hua Yu, Sung-Feng Yeh, Ming-Fa Chen, Hsien-Wei Chen, Ching-Pin Yuan | 2023-08-08 |
| 11309223 | Method of forming semiconductor device package having dummy devices on a first die | Chen-Hua Yu, Sung-Feng Yeh, Ming-Fa Chen, Hsien-Wei Chen, Ching-Pin Yuan | 2022-04-19 |
| 11276958 | Connector | Xian Zhu | 2022-03-15 |
| 10672674 | Method of forming semiconductor device package having testing pads on a topmost die | Chen-Hua Yu, Sung-Feng Yeh, Ming-Fa Chen, Hsien-Wei Chen, Ching-Pin Yuan | 2020-06-02 |
| 10109132 | Sampling method and sampling apparatus for anti-counterfeiting information about cash note | Zhuwen Chen, Bihai Yuan | 2018-10-23 |
| 9469554 | Bipolar electrode and supercapacitor desalination device, and methods of manufacture | Liping Zheng, Hai Yang, Wei Cai, Jianyun Liu, Zhigang Deng +2 more | 2016-10-18 |
| 9127108 | Method for making polymer, and associated polymer, membrane and electrode | Zhigang Deng, Hai Yang, Liping Zheng, Su Lu, Lin Chen +2 more | 2015-09-08 |
| 8878346 | Molded SiP package with reinforced solder columns | Chin-Tien Chiu, Hem Takiar, Jiang Zhu, Jack Chang-Chien, Cheemen Yu | 2014-11-04 |
| 8641454 | Electrical connector | Hsin-Hsun Chen | 2014-02-04 |
| 8211335 | Method for making polymer, coating electrode, and associated polymer and electrode | Zhigang Deng, Hai Yang, Liping Zheng, Su Lu, Lin Chen +2 more | 2012-07-03 |
| 7435624 | Method of reducing mechanical stress on a semiconductor die during fabrication | Chin-Tien Chiu, Hem Takiar, Jiang hua Java Zhu, Jack Chang-Chien, Cheemen Yu | 2008-10-14 |