Issued Patents All Time
Showing 1–11 of 11 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12415952 | Carbon nanodot-polyacrylic acid composite hydrogel, and method for preparing and formulation for forming the same | Wei-Yu Chen, Cheng-Ho Chen, En-Yu Zhou, Chao-Wei Huang, Han-Yi Chou +2 more | 2025-09-16 |
| 12135855 | Electronic device having a biometric input system including a composite cover element | Andrew Deng, Timothy Koch, Andrew W. Joyce, Henry H. Yang, Ran Xu +4 more | 2024-11-05 |
| 11684545 | Hearing training device | Shin-Da LEE, Chen-Chao HSU, Yao-Yu Liao | 2023-06-27 |
| 8952542 | Method for dicing a semiconductor wafer having through silicon vias and resultant structures | Pei Hsing Hua | 2015-02-10 |
| 8643167 | Semiconductor package with through silicon vias and method for making the same | Chia-Lin Hung, Jen-Chuan Chen, Kuo-Pin Yang | 2014-02-04 |
| 8446000 | Package structure and package process | Chi-Chih Shen, Jen-Chuan Chen, Tommy Pan, Chia-Lin Hung | 2013-05-21 |
| 8390129 | Semiconductor device with a plurality of mark through substrate vias | Chi-Chih Shen, Jen-Chuan Chen, Chung-Hsi Wu, Meng-Jen Wang | 2013-03-05 |
| 8258007 | Package process | Chi-Chih Shen, Jen-Chuan Chen, Wen-Hsiung Chang | 2012-09-04 |
| 8105877 | Method of fabricating a stacked type chip package structure | Chi-Chih Shen, Jen-Chuan Chen | 2012-01-31 |
| 8076765 | Stackable semiconductor device packages including openings partially exposing connecting elements, conductive bumps, or conductive conductors | Kuang-Hsiung Chen, Chi-Chih Shen, Jen-Chuan Chen, Wen-Hsiung Chang, Pei-Yu Hsu +5 more | 2011-12-13 |
| 7791211 | Flip chip package structure and carrier thereof | Jen-Chuan Chen, Chi-Chih Shen, Tommy Pan | 2010-09-07 |