Issued Patents All Time
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 8952542 | Method for dicing a semiconductor wafer having through silicon vias and resultant structures | Hui-Shan Chang | 2015-02-10 | $5,873,000 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 8952542 | Method for dicing a semiconductor wafer having through silicon vias and resultant structures | Hui-Shan Chang | 2015-02-10 | $5,873,000 |