Issued Patents All Time
Showing 1–12 of 12 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12129338 | Thermosetting resin composition for semiconductor package, prepreg and metal clad laminate using the same | Changbo SHIM, Seunghyun Song, Hwayeon Moon, Hyunsung Min | 2024-10-29 |
| 12091510 | Thermosetting resin composite and metal clad laminate using the same | Changbo SHIM, Hyunsung Min, Hwayeon Moon, Seunghyun Song | 2024-09-17 |
| 11597837 | Thermosetting resin composition for semiconductor package, prepreg and metal clad laminate using the same | Changbo SHIM, Yongseon Hwang, Hwayeon Moon, Hyunsung Min | 2023-03-07 |
| 11535750 | Thermosetting resin composition for semiconductor package and prepreg and metal clad laminate using the same | Hwa Yeon Moon, Jung-Jin Shim, Hyun Sung Min, Mi Seon Kim, Chang Bo Shim | 2022-12-27 |
| 11459449 | Thermosetting resin composition for coating metal thin film and metal laminate using the same | Minhyuk Yun, Hyunsung Min, Young-chan Kim, Changbo SHIM, Gilsang SON | 2022-10-04 |
| 11274218 | Thermosetting resin composition for coating metal thin film and metal laminate using the same | Minhyuk Yun, Young-chan Kim, Hyunsung Min, Changbo SHIM | 2022-03-15 |
| 11214677 | Resin composition for semiconductor package, prepreg and metal clad laminate using the same | Chang Bo Shim, Hyun Sung Min, Young-chan Kim, Seung Hyun Song | 2022-01-04 |
| 11193015 | Thermosetting resin composition for semiconductor package and prepreg using the same | Hwayeon Moon, Changbo SHIM, Hyunsung Min, Won Ki Kim | 2021-12-07 |
| 11091630 | Resin composition for semiconductor package, prepreg, and metal clad laminate using the same | Chang Bo Shim, Hyun Sung Min, Young-chan Kim, Seung Hyun Song | 2021-08-17 |
| 10913849 | Resin composition for semiconductor package, and prepreg and metal clad laminate using the same | Chang Bo Shim, Hyun Sung Min, Hwa Yeon Moon, Seung Hyun Song, Yong Seon Hwang | 2021-02-09 |
| 10294341 | Thermosetting resin composition for semiconductor package and prepreg using the same | Hwa Yeon Moon, Yong Seon Hwang, Hyun Sung Min, Mi Seon Kim, Chang Bo Shim +3 more | 2019-05-21 |
| 9278505 | Thermosetting resin composition and prepreg and metal clad laminate using the same | Jung-Jin Shim, Jeong-An Kang, Hyun Sung Min | 2016-03-08 |