Issued Patents All Time
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12129338 | Thermosetting resin composition for semiconductor package, prepreg and metal clad laminate using the same | Changbo SHIM, Seunghyun Song, Hwayeon Moon, Hee Yong Shim | 2024-10-29 |
| 12091510 | Thermosetting resin composite and metal clad laminate using the same | Changbo SHIM, Hee Yong Shim, Hwayeon Moon, Seunghyun Song | 2024-09-17 |
| 12037491 | Resin composition, prepreg including the same, laminated plate including the same, resin-coated metal foil including the same | Yongseon Hwang, Changbo SHIM, Hye Rim Park | 2024-07-16 |
| 11597837 | Thermosetting resin composition for semiconductor package, prepreg and metal clad laminate using the same | Changbo SHIM, Yongseon Hwang, Hwayeon Moon, Hee Yong Shim | 2023-03-07 |
| 11459449 | Thermosetting resin composition for coating metal thin film and metal laminate using the same | Minhyuk Yun, Young-chan Kim, Hee Yong Shim, Changbo SHIM, Gilsang SON | 2022-10-04 |
| 11274218 | Thermosetting resin composition for coating metal thin film and metal laminate using the same | Minhyuk Yun, Young-chan Kim, Changbo SHIM, Hee Yong Shim | 2022-03-15 |
| 11193015 | Thermosetting resin composition for semiconductor package and prepreg using the same | Hwayeon Moon, Changbo SHIM, Hee Yong Shim, Won Ki Kim | 2021-12-07 |