Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12129338 | Thermosetting resin composition for semiconductor package, prepreg and metal clad laminate using the same | Changbo SHIM, Seunghyun Song, Hyunsung Min, Hee Yong Shim | 2024-10-29 |
| 12091510 | Thermosetting resin composite and metal clad laminate using the same | Changbo SHIM, Hyunsung Min, Hee Yong Shim, Seunghyun Song | 2024-09-17 |
| 11597837 | Thermosetting resin composition for semiconductor package, prepreg and metal clad laminate using the same | Changbo SHIM, Yongseon Hwang, Hee Yong Shim, Hyunsung Min | 2023-03-07 |
| 11193015 | Thermosetting resin composition for semiconductor package and prepreg using the same | Changbo SHIM, Hee Yong Shim, Hyunsung Min, Won Ki Kim | 2021-12-07 |