Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12037491 | Resin composition, prepreg including the same, laminated plate including the same, resin-coated metal foil including the same | Changbo SHIM, Hyunsung Min, Hye Rim Park | 2024-07-16 |
| 11597837 | Thermosetting resin composition for semiconductor package, prepreg and metal clad laminate using the same | Changbo SHIM, Hwayeon Moon, Hee Yong Shim, Hyunsung Min | 2023-03-07 |