Issued Patents All Time
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11535750 | Thermosetting resin composition for semiconductor package and prepreg and metal clad laminate using the same | Hwa Yeon Moon, Jung-Jin Shim, Hee Yong Shim, Mi Seon Kim, Chang Bo Shim | 2022-12-27 |
| 11214677 | Resin composition for semiconductor package, prepreg and metal clad laminate using the same | Chang Bo Shim, Hee Yong Shim, Young-chan Kim, Seung Hyun Song | 2022-01-04 |
| 11091630 | Resin composition for semiconductor package, prepreg, and metal clad laminate using the same | Chang Bo Shim, Hee Yong Shim, Young-chan Kim, Seung Hyun Song | 2021-08-17 |
| 10913849 | Resin composition for semiconductor package, and prepreg and metal clad laminate using the same | Chang Bo Shim, Hee Yong Shim, Hwa Yeon Moon, Seung Hyun Song, Yong Seon Hwang | 2021-02-09 |
| 10294341 | Thermosetting resin composition for semiconductor package and prepreg using the same | Hwa Yeon Moon, Yong Seon Hwang, Hee Yong Shim, Mi Seon Kim, Chang Bo Shim +3 more | 2019-05-21 |
| 9278505 | Thermosetting resin composition and prepreg and metal clad laminate using the same | Hee Yong Shim, Jung-Jin Shim, Jeong-An Kang | 2016-03-08 |