Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11535750 | Thermosetting resin composition for semiconductor package and prepreg and metal clad laminate using the same | Jung-Jin Shim, Hee Yong Shim, Hyun Sung Min, Mi Seon Kim, Chang Bo Shim | 2022-12-27 |
| 10913849 | Resin composition for semiconductor package, and prepreg and metal clad laminate using the same | Chang Bo Shim, Hee Yong Shim, Hyun Sung Min, Seung Hyun Song, Yong Seon Hwang | 2021-02-09 |
| 10294341 | Thermosetting resin composition for semiconductor package and prepreg using the same | Yong Seon Hwang, Hee Yong Shim, Hyun Sung Min, Mi Seon Kim, Chang Bo Shim +3 more | 2019-05-21 |