Issued Patents All Time
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11535750 | Thermosetting resin composition for semiconductor package and prepreg and metal clad laminate using the same | Hwa Yeon Moon, Hee Yong Shim, Hyun Sung Min, Mi Seon Kim, Chang Bo Shim | 2022-12-27 |
| 9278505 | Thermosetting resin composition and prepreg and metal clad laminate using the same | Hee Yong Shim, Jeong-An Kang, Hyun Sung Min | 2016-03-08 |
| 8551687 | Alkali developable photosensitive resin composition and dry film manufactured by the same | Kwang Joo Lee, Heon-Sik Song, You-Jin Kyung, Joo-Eun Ko, Jung Il Yoon | 2013-10-08 |
| 8426029 | Metallic laminate and method for preparing the same | Byung-Nam Kim, Heon-Sik Song, Joo-Eun Ko, Soon Yong Park | 2013-04-23 |
| 8221842 | Metallic laminate and method for preparing the same | Byung-Nam Kim, Heon-Sik Song, Joo-Eun Ko, Soon Yong Park | 2012-07-17 |