Issued Patents All Time
Showing 1–22 of 22 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12286564 | Adhesive composition for semiconductor circuit connection, adhesive film for semiconductor, method for manufacturing semiconductor package, and semiconductor package using the same | Youngsam KIM, Kwang Joo Lee, Minsu Jeong, Junghak Kim, Ju Hyeon KIM | 2025-04-29 |
| 12024654 | Non-conductive film and manufacturing method of semiconductor laminate | Eun Yeong KIM, Kwang Joo Lee, Ji Ho HAN, Bora YEON, Mi JANG | 2024-07-02 |
| 11993731 | Adhesive composition for semiconductor circuit connection and adhesive film containing the same | Junghak Kim, Kwang Joo Lee, Minsu Jeong, Ju Hyeon KIM, Youngsam KIM | 2024-05-28 |
| 11702520 | Epoxy resin composition for molding semiconductor, molding film and semiconductor package using the same | Minsu Jeong, Byung Ju Choi, Woo Jae Jeong, Kwang Joo Lee, Eunbyurl CHO | 2023-07-18 |
| 11527503 | Method for manufacturing semiconductor package | Minsu Jeong, Kwang Joo Lee | 2022-12-13 |
| 11515245 | Method for manufacturing insulating layer for semiconductor package and insulating layer for semiconductor package using the same | Minsu Jeong, Byung Ju Choi, Woo Jae Jeong, Kwang Joo Lee, Eunbyurl CHO | 2022-11-29 |
| 11361878 | Method for manufacturing insulating film and semiconductor package | Woo Jae Jeong, Byung Ju Choi, Bo Yun Choi, Kwang Joo Lee, Min Su Jeong | 2022-06-14 |
| 10795259 | Photo-curable and heat-curable resin composition and dry film solder resist | Byung Ju Choi, Woo Jae Jeong, Bo Yun Choi, Min Su Jeong | 2020-10-06 |
| 9788434 | Preparation method for dry film solder resist and film laminate used therein | Min Su Jeong, Byung Ju Choi, Woo Jae Jeong, Bo Yun Choi, Kwang Joo Lee +1 more | 2017-10-10 |
| 9778566 | Photocurable and thermocurable resin composition and dry film solder resist | Byung Ju Choi, Woo Jae Jeong, Bo Yun Choi, Kwang Joo Lee, Min Su Jeong | 2017-10-03 |
| 9410017 | Poly-amic acid, photo-sensitive resin composition, dry film, and circuit board | Jung Hak Kim, Hee Jung Kim, Kwang Joo Lee | 2016-08-09 |
| 9049778 | Polyamic acid, photosensitive resin composition, dry film and circuit board | Hee Jung Kim, Kwang Joo Lee, Jung Hak Kim | 2015-06-02 |
| 8617645 | Multi-component composite film method for preparing the same | Seung Jin Lee, Hyang Mok Lee, Soon-Ho Ahn, Jin-Yeon Cho, Hyun Hang Yong +5 more | 2013-12-31 |
| 8551687 | Alkali developable photosensitive resin composition and dry film manufactured by the same | Kwang Joo Lee, Heon-Sik Song, Joo-Eun Ko, Jung Il Yoon, Jung-Jin Shim | 2013-10-08 |
| 8354219 | Photosensitive resin composition and dry film comprising the same | Hee Jung Kim, Kwang Joo Lee | 2013-01-15 |
| 8288656 | Low temperature curable photosensitive resin composition and dry film manufactured by using the same | Kwang Joo Lee, Joo-Eun Ko, Byung-Nam Kim, Heon-Sik Song, Hee Jung Kim | 2012-10-16 |
| 7709153 | Multi-component composite film method for preparing the same | Seung Jin Lee, Hyang Mok Lee, Soon-Ho Ahn, Jin-Yeon Cho, Hyun Hang Yong +5 more | 2010-05-04 |
| 7491447 | Double-sided metallic laminate and method for manufacturing the same | Soon Yong Park, Heon-Sik Song, Byeong-In Ahn, Joo-Eun Ko, Yong-Jun Park +1 more | 2009-02-17 |
| 7470488 | Multi-component composite film method for preparing the same | Seung Jin Lee, Hyang Mok Lee, Soon-Ho Ahn, Jin-Yeon Cho, Hyun Hang Yong +5 more | 2008-12-30 |
| 7087269 | Multi-component composite membrane and method for preparing the same | Sang-Young Lee, Byeong-In Ahn, Soon Yong Park, Heon-Sik Song | 2006-08-08 |
| 7014948 | Electrochemical device using multicomponent composite membrane film | Seung Jin Lee, Hyang Mok Lee, Soon-Ho Ahn, Jin-Yeon Cho, Hyun Hang Yong +5 more | 2006-03-21 |
| 6830849 | High crystalline polypropylene microporous membrane, multi-component microporous membrane and methods for preparing the same | Sang-Young Lee, Byeong-In Ahn, Sung Gap Im, Soon Yong Park, Heon-Sik Song | 2004-12-14 |