Issued Patents All Time
Showing 1–14 of 14 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12111145 | Blasting design device, blasting system and operation method of same | Dong Hee Lee, Seung Joong Lee | 2024-10-08 |
| 11361878 | Method for manufacturing insulating film and semiconductor package | Woo Jae Jeong, You-Jin Kyung, Byung Ju Choi, Bo Yun Choi, Kwang Joo Lee | 2022-06-14 |
| 10795259 | Photo-curable and heat-curable resin composition and dry film solder resist | Byung Ju Choi, You-Jin Kyung, Woo Jae Jeong, Bo Yun Choi | 2020-10-06 |
| 9880467 | Photo-curable and thermo-curable resin composition and dry film solder resist | Byung Ju Choi, Woo Jae Jeong, Bo Yun Choi, Kwang Joo Lee | 2018-01-30 |
| 9865480 | Printed circuit board including under-fill dam and fabrication method thereof | Byung Ju Choi, Woo Jae Jeong, Bo Yun Choi, Kwang Joo Lee | 2018-01-09 |
| 9788434 | Preparation method for dry film solder resist and film laminate used therein | You-Jin Kyung, Byung Ju Choi, Woo Jae Jeong, Bo Yun Choi, Kwang Joo Lee +1 more | 2017-10-10 |
| 9778566 | Photocurable and thermocurable resin composition and dry film solder resist | Byung Ju Choi, You-Jin Kyung, Woo Jae Jeong, Bo Yun Choi, Kwang Joo Lee | 2017-10-03 |
| 9416243 | Photocurable and thermosetting resin composition, dry film solder resist manufactured therefrom, and circuit board including the solder resist | Byung Ju Choi, Woo Jae Jeong, Bo Yun Choi, Kwang Joo Lee, Se Jin Ku | 2016-08-16 |
| 9389504 | Photo-curable and thermo-curable resin composition, and dry film solder resist | Se Jin Ku, Byung Ju Choi, Woo Jae Jeong, Bo Yun Choi, Kwang Joo Lee | 2016-07-12 |
| 9134609 | Photo-curable and thermo-curable resin compostion, and dry film solder resist | Se Jin Ku, Byung Ju Choi, Woo Jae Jeong, Bo Yun Choi, Kwang Joo Lee | 2015-09-15 |
| 8349538 | Photo-curable and thermo-curable resin composition, and a dry film solder resist | Woo Jae Jeong, Byung Ju Choi, Bo Yun Choi, Kwang Joo Lee | 2013-01-08 |
| 8334092 | Photo-sensitive resin composition and a protective film for printed circuit board having superior heat resistant and mechanical property | Bo Yun Choi, Byung Ju Choi, Woo Jae Jeong, Kwang Joo Lee | 2012-12-18 |
| 5959656 | Method and apparatus for enhancing laser printer resolution by using a laser beam modulation technique | Yong-Bae Dhong, Soo-Won Kim, Jin Tae Kim | 1999-09-28 |
| 5712675 | Method and apparatus for enhancing laser printer resolution | Yong-Bae Dhong, Soo-Won Kim | 1998-01-27 |