Issued Patents All Time
Showing 1–16 of 16 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12404610 | MXene fibers and preparation method thereof | Tae Hee Han, Won Sik Eom, Sang Hoon Lee, Hwan Soo Shin | 2025-09-02 |
| 12313973 | Insulating layer for multilayer printed circuit board, multilayer printed circuit board comprising same, and method for producing same | Jeong Wook MUN, Kong-Kyeom Kim, Jee Hyeon Hwang, Eun Byurl CHO, Jeong Hyuk Ahn | 2025-05-27 |
| 11811434 | Device and method for transmitting and receiving emulated Wi-Fi packets | Song Min KIM, Jin Hwan Jung, Seok Won Yang, Yung Yi | 2023-11-07 |
| 11702520 | Epoxy resin composition for molding semiconductor, molding film and semiconductor package using the same | Minsu Jeong, You-Jin Kyung, Byung Ju Choi, Kwang Joo Lee, Eunbyurl CHO | 2023-07-18 |
| 11515245 | Method for manufacturing insulating layer for semiconductor package and insulating layer for semiconductor package using the same | Minsu Jeong, You-Jin Kyung, Byung Ju Choi, Kwang Joo Lee, Eunbyurl CHO | 2022-11-29 |
| 11361878 | Method for manufacturing insulating film and semiconductor package | You-Jin Kyung, Byung Ju Choi, Bo Yun Choi, Kwang Joo Lee, Min Su Jeong | 2022-06-14 |
| 10795259 | Photo-curable and heat-curable resin composition and dry film solder resist | Byung Ju Choi, You-Jin Kyung, Bo Yun Choi, Min Su Jeong | 2020-10-06 |
| 9880467 | Photo-curable and thermo-curable resin composition and dry film solder resist | Min Su Jeong, Byung Ju Choi, Bo Yun Choi, Kwang Joo Lee | 2018-01-30 |
| 9865480 | Printed circuit board including under-fill dam and fabrication method thereof | Byung Ju Choi, Bo Yun Choi, Kwang Joo Lee, Min Su Jeong | 2018-01-09 |
| 9788434 | Preparation method for dry film solder resist and film laminate used therein | Min Su Jeong, You-Jin Kyung, Byung Ju Choi, Bo Yun Choi, Kwang Joo Lee +1 more | 2017-10-10 |
| 9778566 | Photocurable and thermocurable resin composition and dry film solder resist | Byung Ju Choi, You-Jin Kyung, Bo Yun Choi, Kwang Joo Lee, Min Su Jeong | 2017-10-03 |
| 9416243 | Photocurable and thermosetting resin composition, dry film solder resist manufactured therefrom, and circuit board including the solder resist | Byung Ju Choi, Bo Yun Choi, Kwang Joo Lee, Min Su Jeong, Se Jin Ku | 2016-08-16 |
| 9389504 | Photo-curable and thermo-curable resin composition, and dry film solder resist | Se Jin Ku, Byung Ju Choi, Bo Yun Choi, Kwang Joo Lee, Min Su Jeong | 2016-07-12 |
| 9134609 | Photo-curable and thermo-curable resin compostion, and dry film solder resist | Se Jin Ku, Byung Ju Choi, Bo Yun Choi, Kwang Joo Lee, Min Su Jeong | 2015-09-15 |
| 8349538 | Photo-curable and thermo-curable resin composition, and a dry film solder resist | Byung Ju Choi, Bo Yun Choi, Kwang Joo Lee, Min Su Jeong | 2013-01-08 |
| 8334092 | Photo-sensitive resin composition and a protective film for printed circuit board having superior heat resistant and mechanical property | Bo Yun Choi, Byung Ju Choi, Kwang Joo Lee, Min Su Jeong | 2012-12-18 |