Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12313973 | Insulating layer for multilayer printed circuit board, multilayer printed circuit board comprising same, and method for producing same | Jeong Wook MUN, Kong-Kyeom Kim, Woo Jae Jeong, Jee Hyeon Hwang, Jeong Hyuk Ahn | 2025-05-27 |
| 11390113 | Decoration member and method for manufacturing decoration member | Yong Chan Kim, Ki Hwan Kim, Jeong Woo Shon, Jin Suk Song, Song Ho Jang +3 more | 2022-07-19 |
| 11376888 | Decorative member and method for manufacturing decorative member | Yong Chan Kim, Jeong Woo Shon, Pilsung Jo, Nansra Heo, Jin Suk Song +3 more | 2022-07-05 |
| 10615373 | Substrate | Yong Nam Kim, Yeon Keun Lee, Mun Kyu Joo, Jong Seok Kim | 2020-04-07 |