Issued Patents All Time
Showing 1–25 of 54 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12378447 | Semiconductor adhesive composition and semiconductor adhesive film comprising cured product thereof | Eun-Bum Kim, Jung Hak Kim, Ju Hyeon KIM, Yoon Sun Jang | 2025-08-05 |
| 12341033 | Apparatus for separating semiconductor chip and method for separating semiconductor by using same | Eun-Bum Kim, Ju Hyeon KIM, Jung Hak Kim, Yoon Sun Jang | 2025-06-24 |
| 12286564 | Adhesive composition for semiconductor circuit connection, adhesive film for semiconductor, method for manufacturing semiconductor package, and semiconductor package using the same | Youngsam KIM, You-Jin Kyung, Minsu Jeong, Junghak Kim, Ju Hyeon KIM | 2025-04-29 |
| 12065595 | Adhesive sheet for temporary attachment and method for producing semiconductor device using the same | Sera Kim, Ji Ho HAN, Mi JANG | 2024-08-20 |
| 12024654 | Non-conductive film and manufacturing method of semiconductor laminate | Eun Yeong KIM, You-Jin Kyung, Ji Ho HAN, Bora YEON, Mi JANG | 2024-07-02 |
| 12006308 | Adhesive composition for semiconductor circuit connection and adhesive film containing the same | Youngsam KIM, Junghak Kim, Ju Hyeon KIM | 2024-06-11 |
| 11993731 | Adhesive composition for semiconductor circuit connection and adhesive film containing the same | Junghak Kim, You-Jin Kyung, Minsu Jeong, Ju Hyeon KIM, Youngsam KIM | 2024-05-28 |
| 11939494 | Resin composition for bonding semiconductor and adhesive film for semiconductor using the same | Jong Min Jang, Byoung Ju Choi, Yu Sun | 2024-03-26 |
| 11932784 | Adhesive composition for dicing tape and dicing tape comprising the same | Da Ae KIM, Ji Ho HAN, Eun Yeong KIM, Mi JANG | 2024-03-19 |
| 11879075 | Resin composition for bonding semiconductors, adhesive film for semiconductor using the same, dicing die bonding film, and method for dicing semiconductor wafer | Wanjung Kim, Jong Min Jang, Byung Ju Choi | 2024-01-23 |
| 11834415 | Adhesive composition for semiconductor circuit connection and adhesive film including the same | Ju Hyeon KIM, Junghak Kim, SeungHee NAM | 2023-12-05 |
| 11760907 | Adhesive resin composition for semiconductor, adhesive film for semiconductor device using the same and dicing die bonding film using the same | Jong Min Jang, Yu Sun | 2023-09-19 |
| 11702520 | Epoxy resin composition for molding semiconductor, molding film and semiconductor package using the same | Minsu Jeong, You-Jin Kyung, Byung Ju Choi, Woo Jae Jeong, Eunbyurl CHO | 2023-07-18 |
| 11702571 | Adhesive sheet for temporary fixation and method of manufacturing semiconductor device using the same | Sera Kim, Ji Ho HAN | 2023-07-18 |
| 11527503 | Method for manufacturing semiconductor package | You-Jin Kyung, Minsu Jeong | 2022-12-13 |
| 11515245 | Method for manufacturing insulating layer for semiconductor package and insulating layer for semiconductor package using the same | Minsu Jeong, You-Jin Kyung, Byung Ju Choi, Woo Jae Jeong, Eunbyurl CHO | 2022-11-29 |
| 11479699 | Adhesive film for semiconductor | Jong Min Jang, Heejung KIM | 2022-10-25 |
| 11466184 | Adhesive composition | Mi JANG, Sera Kim, Ji Ho HAN, Bora YEON, Kwang Su Seo | 2022-10-11 |
| 11466178 | Back-grinding tape | Eun Yeong KIM, Sera Kim, Sang Hwan Kim, Sung Chan Park, Mi Seon YOON | 2022-10-11 |
| 11424153 | Back grinding tape | Mi Seon YOON, Sera Kim, Bora YEON, Sang Hwan Kim, Eun Yeong KIM | 2022-08-23 |
| 11404301 | Dicing die-bonding film | Ji Ho HAN, Se Ra Kim, Mun Seop Song, Yeong Im Yu | 2022-08-02 |
| 11361878 | Method for manufacturing insulating film and semiconductor package | Woo Jae Jeong, You-Jin Kyung, Byung Ju Choi, Bo Yun Choi, Min Su Jeong | 2022-06-14 |
| 11178730 | Method for manufacturing heating element | Ji-Eun Myung, Sera Kim, Jooyeon Kim, Chang Yoon Lim, Seung Heon Lee +2 more | 2021-11-16 |
| 11021634 | Adhesive film, preparation method of semiconductor device, and semiconductor device | Jung Hak Kim, Hee Jung Kim, Se Ra Kim, Young-Kook Kim, Seung Hee Nam | 2021-06-01 |
| 10991678 | Semiconductor device and method for manufacturing semiconductor device | Jung Hak Kim, Hee Jung Kim, Se Ra Kim, Jung Ho Jo, Seung Hee Nam +1 more | 2021-04-27 |