| 12065595 |
Adhesive sheet for temporary attachment and method for producing semiconductor device using the same |
Ji Ho HAN, Mi JANG, Kwang Joo Lee |
2024-08-20 |
| 11702571 |
Adhesive sheet for temporary fixation and method of manufacturing semiconductor device using the same |
Ji Ho HAN, Kwang Joo Lee |
2023-07-18 |
| 11466184 |
Adhesive composition |
Mi JANG, Ji Ho HAN, Kwang Joo Lee, Bora YEON, Kwang Su Seo |
2022-10-11 |
| 11466178 |
Back-grinding tape |
Eun Yeong KIM, Kwang Joo Lee, Sang Hwan Kim, Sung Chan Park, Mi Seon YOON |
2022-10-11 |
| 11424153 |
Back grinding tape |
Mi Seon YOON, Kwang Joo Lee, Bora YEON, Sang Hwan Kim, Eun Yeong KIM |
2022-08-23 |
| 11178730 |
Method for manufacturing heating element |
Ji-Eun Myung, Jooyeon Kim, Chang Yoon Lim, Seung Heon Lee, Mun Seop Song +2 more |
2021-11-16 |
| 10796818 |
Heating element |
Ji-Eun Myung, Jooyeon Kim, Chang Yoon Lim, Seung Heon Lee, Mun Seop Song +2 more |
2020-10-06 |
| 7462663 |
Pressure-sensitive adhesive composition |
Michael Kim, Noma Kim, Sukky Chang |
2008-12-09 |
| 7262313 |
Organic silane compound |
Michael Kim, Noma Kim, Anna Lee, Sukky Chang, Sungchul Lim |
2007-08-28 |
