HA

Harold Anderson

ON onsemi: 6 patents #266 of 1,901Top 15%
Motorola: 1 patents #6,475 of 12,470Top 55%
GE: 1 patents #19,878 of 36,430Top 55%
Overall (All Time): #503,720 of 4,157,543Top 15%
10
Patents All Time

Issued Patents All Time

Patent #TitleCo-InventorsDate
10535623 Wire bonding systems and related methods Wentao Qin, Gordon M. Grivna, Thomas A. Anderson, George Chang 2020-01-14
10109610 Wire bonding systems and related methods Wentao Qin, Gordon M. Grivna, Thomas A. Anderson, George Chang 2018-10-23
9812424 Process of forming an electronic device including a ball bond Cang Ngo 2017-11-07
8574961 Method of marking a low profile packaged semiconductor device James H. Knapp, Jay A. Yoder 2013-11-05
8366201 Method for open pit bench mining Garry Drummond, Eugene Honeycutt 2013-02-05
7726465 Method and apparatus for open pit bench mining Garry Drummond, Eugene Honeycutt 2010-06-01
7382059 Semiconductor package structure and method of manufacture Cang Ngo, Yong Li Xu, James W. Mohr 2008-06-03
7227240 Semiconductor device with wire bond inductor and method James H. Knapp, Francis J. Carney, Yenting Wen, Cang Ngo 2007-06-05
6118175 Wire bonding support structure and method for coupling a semiconductor chip to a leadframe Albert J. Laninga, Rodney D. Purcell, Gilbert J. Archibeque, Jr., Stefan M. Dykert 2000-09-12
4208608 Lamp mount structure 1980-06-17