Issued Patents All Time
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6118175 | Wire bonding support structure and method for coupling a semiconductor chip to a leadframe | Harold Anderson, Albert J. Laninga, Rodney D. Purcell, Gilbert J. Archibeque, Jr. | 2000-09-12 |