Issued Patents All Time
Showing 26–50 of 73 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6156634 | Method of fabricating local interconnect | — | 2000-12-05 |
| 6140198 | Method of fabricating load resistor | — | 2000-10-31 |
| 6111319 | Method of forming submicron contacts and vias in an integrated circuit | Mehdi Zamanian | 2000-08-29 |
| 6033980 | Method of forming submicron contacts and vias in an integrated circuit | Mehdi Zamanian | 2000-03-07 |
| 6031293 | Package-free bonding pad structure | Min-Chih Hsuan | 2000-02-29 |
| 6017790 | Method of manufacturing embedded dynamic random access memory | Water Lur | 2000-01-25 |
| 5976969 | Method for forming an aluminum contact | Yih-Shung Lin | 1999-11-02 |
| 5930673 | Method for forming a metal contact | Fusen Chen, Yih-Shung Lin, Girish Dixit, Che-Chia Wei | 1999-07-27 |
| 5847465 | Contacts for semiconductor devices | Yu-Pin Han | 1998-12-08 |
| 5847457 | Structure and method of forming vias | Fusen Chen, Girish Dixit | 1998-12-08 |
| 5847460 | Submicron contacts and vias in an integrated circuit | Mehdi Zamanian | 1998-12-08 |
| 5841195 | Semiconductor contact via structure | Yih-Shung Lin, Lun-Tseng Lu, Che-Chia Wei, John L. Walters | 1998-11-24 |
| 5658828 | Method for forming an aluminum contact through an insulating layer | Yih-Shung Lin | 1997-08-19 |
| 5593921 | Method of forming vias | Fusen Chen, Girish Dixit | 1997-01-14 |
| 5594269 | Resistive load for integrated circuit devices | Charles R. Spinner, III | 1997-01-14 |
| RE35111 | Local interconnect process for integrated circuits | Yih-Shung Lin, Fusen Chen | 1995-12-05 |
| 5462894 | Method for fabricating a polycrystalline silicon resistive load element in an integrated circuit | Charles R. Spinner, III | 1995-10-31 |
| 5424571 | Sloped spacer for mos field effect devices | — | 1995-06-13 |
| 5410176 | Integrated circuit with planarized shallow trench isolation | Fusen Chen | 1995-04-25 |
| 5391520 | Method for forming local interconnect for integrated circuits | Fusen Chen, Girish Dixit | 1995-02-21 |
| 5371410 | Integrated circuit metallization with zero contact enclosure requirements | Fusen Chen | 1994-12-06 |
| 5371041 | Method for forming a contact/VIA | Robert O. Miller, Mohammed M. Farohani, Yu-Pin Han | 1994-12-06 |
| 5349229 | Local interconnect for integrated circuits | Che-Chia Wei | 1994-09-20 |
| 5319245 | Local interconnect for integrated circuits | Fusen Chen, Girish Dixit | 1994-06-07 |
| 5286672 | Method for forming field oxide regions | Robert Louis Hodges | 1994-02-15 |