Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6992389 | Barrier for interconnect and method | Panayotis Andricacos, Tien-Jen Cheng, Emanuel I. Cooper, David E. Eichstadt, Jonathan H. Griffith +2 more | 2006-01-31 |
| 6622907 | Sacrificial seed layer process for forming C4 solder bumps | Lisa A. Fanti, Randolph F. Knarr, Kamalesh K. Srivastava | 2003-09-23 |