DC

Dennis A. Canfield

IBM: 3 patents #26,272 of 70,183Top 40%
Overall (All Time): #1,654,674 of 4,157,543Top 40%
3
Patents All Time

Issued Patents All Time

Patent #TitleCo-InventorsDate
5318803 Conditioning of a substrate for electroless plating thereon Harry R. Bickford, Arthur E. Graham, Stephen L. Tisdale, Alfred Viehbeck 1994-06-07
5229550 Encapsulated circuitized power core alignment and lamination Perminder S. Bindra, Voya R. Markovich, Jeffrey McKeveny, Robert E. Ruane, Edwin L. Thomas 1993-07-20
5129142 Encapsulated circuitized power core alignment and lamination Perminder S. Bindra, Voya R. Markovich, Jeffrey McKeveny, Robert E. Ruane, Edwin L. Thomas 1992-07-14