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Contact pads for electronic substrates and related methods |
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| 10882740 |
Wafer-level package with enhanced performance and manufacturing method thereof |
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2021-01-05 |
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Double-sided module with electromagnetic shielding |
Thomas Scott Morris, Brian Howard Calhoun |
2021-01-05 |
| 10773952 |
Wafer-level package with enhanced performance |
Julio C. Costa, Jon Chadwick, Merrill Albert Hatcher, Jr., Jonathan Hale Hammond |
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| 10043707 |
Additive conductor redistribution layer (ACRL) |
John August Orlowski |
2018-08-07 |
| 10020206 |
Encapsulated dies with enhanced thermal performance |
Thomas Scott Morris, Stephen Parker, Jon Chadwick, Julio C. Costa |
2018-07-10 |
| 9960145 |
Flip chip module with enhanced properties |
Julio C. Costa, Thomas Scott Morris, Jonathan Hale Hammond, Stephen Parker, Jon Chadwick |
2018-05-01 |
| 9613831 |
Encapsulated dies with enhanced thermal performance |
Thomas Scott Morris, Stephen Parker, Jon Chadwick, Julio C. Costa |
2017-04-04 |
| 8409658 |
Conformal shielding process using flush structures |
David Jon Hiner, Waite R. Warren, Jr. |
2013-04-02 |
| 8296941 |
Conformal shielding employing segment buildup |
David Jon Hiner, Waite R. Warren, Jr., Donald Joseph Leahy, Thomas Scott Morris, David Halchin +5 more |
2012-10-30 |
| 5892661 |
Smartcard and method of making |
John W. Stafford, Theodore G. Tessier |
1999-04-06 |
| 5816478 |
Fluxless flip-chip bond and a method for making |
Kenneth Kaskoun, John W. Stafford |
1998-10-06 |
| 5789815 |
Three dimensional semiconductor package having flexible appendages |
Theodore G. Tessier, John W. Stafford |
1998-08-04 |
| 5661088 |
Electronic component and method of packaging |
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1997-08-26 |
