Issued Patents All Time
Showing 1–23 of 23 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12368056 | RF devices with enhanced performance and methods of forming the same | Julio C. Costa, Michael Carroll, Philip W. Mason | 2025-07-22 |
| 12046483 | RF devices with enhanced performance and methods of forming the same | Julio C. Costa, Michael Carroll, Philip W. Mason | 2024-07-23 |
| 11387157 | RF devices with enhanced performance and methods of forming the same | Julio C. Costa, Michael Carroll, Philip W. Mason | 2022-07-12 |
| 11063021 | Microelectronics package with vertically stacked dies | Julio C. Costa, Robert Aigner, Gernot Fattinger, Dirk Robert Walter Leipold, George Maxim +2 more | 2021-07-13 |
| 10882740 | Wafer-level package with enhanced performance and manufacturing method thereof | Julio C. Costa, Jon Chadwick, David Jandzinski, Jonathan Hale Hammond | 2021-01-05 |
| 10804179 | Wafer-level package with enhanced performance | Julio C. Costa, Jan Edward Vandemeer, Jonathan Hale Hammond, Jon Chadwick | 2020-10-13 |
| 10804246 | Microelectronics package with vertically stacked dies | Julio C. Costa, Robert Aigner, Gernot Fattinger, Dirk Robert Walter Leipold, George Maxim +2 more | 2020-10-13 |
| 10773952 | Wafer-level package with enhanced performance | Julio C. Costa, Jon Chadwick, David Jandzinski, Jonathan Hale Hammond | 2020-09-15 |
| 10755992 | Wafer-level packaging for enhanced performance | Julio C. Costa, Peter V. Wright, Jon Chadwick | 2020-08-25 |
| 10490471 | Wafer-level packaging for enhanced performance | Julio C. Costa, Peter V. Wright, Jon Chadwick | 2019-11-26 |
| 10486963 | Wafer-level package with enhanced performance | Jonathan Hale Hammond, Jon Chadwick, Julio C. Costa, Jan Edward Vandemeer | 2019-11-26 |
| 10262915 | Thermally enhanced semiconductor package with thermal additive and process for making the same | Julio C. Costa, George Maxim, Dirk Robert Walter Leipold, Baker Scott, Stephen Mobley | 2019-04-16 |
| 10109550 | Wafer-level package with enhanced performance | Julio C. Costa, Jonathan Hale Hammond, Jan Edward Vandemeer, Jon Chadwick | 2018-10-23 |
| 10103080 | Thermally enhanced semiconductor package with thermal additive and process for making the same | Julio C. Costa, George Maxim, Dirk Robert Walter Leipold, Baker Scott, Stephen Mobley | 2018-10-16 |
| 9349938 | Atomic layer deposition encapsulation for acoustic wave devices | Jayanti Jaganatha Rao, John Robert Siomkos | 2016-05-24 |
| 9082953 | Atomic layer deposition encapsulation for acoustic wave devices | Jayanti Jaganatha Rao, John Robert Siomkos | 2015-07-14 |
| 8492908 | Atomic layer deposition encapsulation for power amplifiers in RF circuits | John Robert Siomkos, Jayanti Jaganatha Rao | 2013-07-23 |
| 8440012 | Atomic layer deposition encapsulation for acoustic wave devices | Jayanti Jaganatha Rao, John Robert Siomkos | 2013-05-14 |
| 8313985 | Atomic layer deposition encapsulation for power amplifiers in RF circuits | Jayanti Jaganatha Rao, John Robert Siomkos | 2012-11-20 |
| 6649446 | Hermetic package for multiple contact-sensitive electronic devices and methods of manufacturing thereof | Martin Goetz, Christopher Ellis Jones | 2003-11-18 |
| 6639150 | Hermetic package for surface acoustic wave device having exposed device substrate contacts and method of manufacturing the same | Martin Goetz, Christopher Ellis Jones | 2003-10-28 |
| 6621379 | Hermetic package for surface acoustic wave device and method of manufacturing the same | Martin Goetz, Christopher Ellis Jones | 2003-09-16 |
| 6507097 | Hermetic package for pyroelectric-sensitive electronic device and method of manufacturing the same | Martin Goetz, Christopher Ellis Jones | 2003-01-14 |