Issued Patents All Time
Showing 1–23 of 23 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8806742 | Method of making an electronic package | Erwin B. Cohen, Jennifer V. Muncy | 2014-08-19 |
| 8767411 | Electronic device with aerogel thermal isolation | Gary E. O'Neil | 2014-07-01 |
| 8231692 | Method for manufacturing an electronic device | Gary E. O'Neil | 2012-07-31 |
| 7671984 | Spectrometric measuring probe and method for recalibrating the same | Wilhelm Schebesta, Werner Hoyme, Michael Rode, Nico Correns | 2010-03-02 |
| 7665196 | Method for forming a multi-frequency surface acoustic wave device | David M. Lee, Paul Lindars, Christopher Ellis Jones, James E. Flowers | 2010-02-23 |
| 7299528 | Method for forming a multi-frequency surface acoustic wave device | David M. Lee, Paul Lindars, Christopher Ellis Jones, James E. Flowers | 2007-11-27 |
| 6744336 | Wafer-scale package for surface acoustic wave circuit and method of manufacturing the same | Sarah Schwab | 2004-06-01 |
| 6650205 | Wafer-scale package for surface acoustic wave circuit and method of manufacturing the same | Sarah Schwab | 2003-11-18 |
| 6649446 | Hermetic package for multiple contact-sensitive electronic devices and methods of manufacturing thereof | Merrill Albert Hatcher, Jr., Christopher Ellis Jones | 2003-11-18 |
| 6639150 | Hermetic package for surface acoustic wave device having exposed device substrate contacts and method of manufacturing the same | Merrill Albert Hatcher, Jr., Christopher Ellis Jones | 2003-10-28 |
| 6621379 | Hermetic package for surface acoustic wave device and method of manufacturing the same | Merrill Albert Hatcher, Jr., Christopher Ellis Jones | 2003-09-16 |
| 6507097 | Hermetic package for pyroelectric-sensitive electronic device and method of manufacturing the same | Merrill Albert Hatcher, Jr., Christopher Ellis Jones | 2003-01-14 |
| 6495398 | Wafer-scale package for surface acoustic wave circuit and method of manufacturing the same | — | 2002-12-17 |
| 6436735 | Method for mounting an integrated circuit having reduced thermal stresses between a bond pad and a metallic contact | Sammy K. Brown, George E. Avery, Andrew K. Wiggin, Tom L. Todd, Sam Beal | 2002-08-20 |
| 6337576 | Wafer-level burn-in | Andrew K. Wiggin, Allan Calamoneri, John J. Zasio, George E. Avery, Sammy K. Brown | 2002-01-08 |
| 6300161 | Module and method for interconnecting integrated circuits that facilitates high speed signal propagation with reduced noise | John J. Zasio | 2001-10-09 |
| 6175161 | System and method for packaging integrated circuits | Sammy K. Brown, George E. Avery, Andrew K. Wiggin, Tom L. Todd, Sam Beal | 2001-01-16 |
| 6172412 | High frequency microelectronics package | Deborah S. Wein, Paul M. Anderson, Alan Lindner, Joseph Babiarz, Timothy Going | 2001-01-09 |
| 5753972 | Microelectronics package | Deborah S. Wein, Paul M. Anderson, Alan Lindner, Joseph Babiarz | 1998-05-19 |
| 5736783 | High frequency microelectronics package | Deborah S. Wein, Paul M. Anderson, Alan Lindner, Joseph Babiarz, Timothy Going | 1998-04-07 |
| 5692298 | Method of making ceramic microwave electronic package | Joseph Babiarz | 1997-12-02 |
| 5465008 | Ceramic microelectronics package | Joseph Babiarz, Deborah S. Wein, Paul M. Anderson, Alan Lindner | 1995-11-07 |
| 5448826 | Method of making ceramic microwave electronic package | Joseph Babiarz | 1995-09-12 |