Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6436735 | Method for mounting an integrated circuit having reduced thermal stresses between a bond pad and a metallic contact | Martin Goetz, Sammy K. Brown, George E. Avery, Andrew K. Wiggin, Tom L. Todd | 2002-08-20 |
| 6175161 | System and method for packaging integrated circuits | Martin Goetz, Sammy K. Brown, George E. Avery, Andrew K. Wiggin, Tom L. Todd | 2001-01-16 |
| 6128201 | Three dimensional mounting assembly for integrated circuits | Sammy K. Brown, George E. Avery, Andrew K. Wiggin, Tom L. Todd | 2000-10-03 |