Issued Patents All Time
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6436735 | Method for mounting an integrated circuit having reduced thermal stresses between a bond pad and a metallic contact | Martin Goetz, Sammy K. Brown, Andrew K. Wiggin, Tom L. Todd, Sam Beal | 2002-08-20 |
| 6400575 | Integrated circuits packaging system and method | Sammy K. Brown, Andrew K. Wiggin, Samuel W. Beal | 2002-06-04 |
| 6337576 | Wafer-level burn-in | Andrew K. Wiggin, Allan Calamoneri, Martin Goetz, John J. Zasio, Sammy K. Brown | 2002-01-08 |
| 6175161 | System and method for packaging integrated circuits | Martin Goetz, Sammy K. Brown, Andrew K. Wiggin, Tom L. Todd, Sam Beal | 2001-01-16 |
| 6128201 | Three dimensional mounting assembly for integrated circuits | Sammy K. Brown, Andrew K. Wiggin, Tom L. Todd, Sam Beal | 2000-10-03 |
| 6075711 | System and method for routing connections of integrated circuits | Sammy K. Brown, Andrew K. Wiggin | 2000-06-13 |