Issued Patents All Time
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11765826 | Method of fabricating contact pads for electronic substrates | Thomas Scott Morris, David Jandzinski | 2023-09-19 |
| 11596058 | Fiducials for laminate structures | Stephen Parker, James Edwin Culler, Jr. | 2023-02-28 |
| 11244786 | Substrates with integrated three dimensional inductors with via columns | Dirk Robert Walter Leipold, George Maxim, Baker Scott | 2022-02-08 |
| 11094459 | Substrates with integrated three dimensional inductors with via columns | Dirk Robert Walter Leipold, George Maxim, Baker Scott | 2021-08-17 |
| 10905007 | Contact pads for electronic substrates and related methods | Thomas Scott Morris, David Jandzinski | 2021-01-26 |
| 10796835 | Stacked laminate inductors for high module volume utilization and performance-cost-size-processing-time tradeoff | Michael F. Zybura, George Maxim, Dirk Robert Walter Leipold, Baker Scott | 2020-10-06 |
| 10483035 | Substrates with integrated three dimensional solenoid inductors | Dirk Robert Walter Leipold, George Maxim, Baker Scott | 2019-11-19 |
| 10043707 | Additive conductor redistribution layer (ACRL) | David Jandzinski | 2018-08-07 |