Issued Patents All Time
Showing 1–17 of 17 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9638597 | Differential pressure sensor assembly | Stephen R. Hooper, Thomas Cobb Speight | 2017-05-02 |
| 9598280 | Environmental sensor structure | Akhilesh Kumar Singh, Dwight L. Daniels, Stephen R. Hooper | 2017-03-21 |
| 9510495 | Electronic devices with cavity-type, permeable material filled packages, and methods of their manufacture | Stephen R. Hooper, William C. Stermer, Jr. | 2016-11-29 |
| 9466413 | Die-to-die inductive communication devices and methods | Fred T. Brauchler, John M. Pigott, Vivek Gupta, Randall C. Gray, Norman L. Owens +1 more | 2016-10-11 |
| 8742555 | Lead frame having a flag with in-plane and out-of-plane mold locking features | Jian Wen, William G. McDonald | 2014-06-03 |
| 8217511 | Redistributed chip packaging with thermal contact to device backside | Neil T. Tracht, James R. Griffiths, Lizabeth Keser, Tien-Yu Lee, Elie A. Maalouf | 2012-07-10 |
| 8097494 | Method of making an integrated circuit package with shielding via ring structure | Jinbang Tang, Jong-Kai Lin, Marc Alan Mangrum, Robert E. Booth, Lawrence N. Herr +1 more | 2012-01-17 |
| 7981730 | Integrated conformal shielding method and process using redistributed chip packaging | Jinbang Tang, Scott M. Hayes, Douglas G. Mitchell | 2011-07-19 |
| 7838420 | Method for forming a packaged semiconductor device | Jinbang Tang, William H. Lytle | 2010-11-23 |
| 7763976 | Integrated circuit module with integrated passive device | Jinbang Tang, Robert J. Wenzel | 2010-07-27 |
| 7651889 | Electromagnetic shield formation for integrated circuit die package | Jinbang Tang, Jong-Kai Lin, Marc Alan Mangrum, Robert E. Booth, Lawrence N. Herr +1 more | 2010-01-26 |
| 7074647 | Semiconductor component comprising leadframe, semiconductor chip and integrated passive component in vertical relationship to each other | Norman L. Owens | 2006-07-11 |
| 6630725 | Electronic component and method of manufacture | Shun-Meen Kuo | 2003-10-07 |
| 6140904 | Thermal disconnect for high-temperature batteries | Rudolph George Jungst, James R. Armijo | 2000-10-31 |
| 6064293 | Thermal fuse for high-temperature batteries | Rudolph George Jungst, James R. Armijo | 2000-05-16 |
| 5855323 | Method and apparatus for jetting, manufacturing and attaching uniform solder balls | Frederick G. Yost, David T. Schmale | 1999-01-05 |
| 5300307 | Microstructure control of Al-Cu films for improved electromigration resistance | Joseph R. Michael, Alton D. Romig, Jr. | 1994-04-05 |