Issued Patents All Time
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12193166 | Printed circuit board having a sacrificial pad to mitigate galvanic corrosion | Songtao Lu, Hsiang Ju Huang, Binbin Zheng, Chien-Te Chen | 2025-01-07 |
| 11569155 | Substrate bonding pad having a multi-surface trace interface | Chih-Chin Liao | 2023-01-31 |
| 11234327 | Printed circuit board trace for galvanic effect reduction | Songtao Lu, Yuequan Shi, Ye Bai, Chih-Chin Liao, JinXiang Huang | 2022-01-25 |
| 8858808 | Method of thin printed circuit board wet process consistency on the same carrier | — | 2014-10-14 |
| 8837808 | Method of final defect inspection | Chia-Chi Lo, Jun Chung Hsu | 2014-09-16 |
| 8547548 | Final defect inspection system | Chia-Chi Lo, Jun Chung Hsu | 2013-10-01 |
| 6979886 | Short-prevented lead frame and method for fabricating semiconductor package with the same | Jui-Hsiang Hung, Chin-Teng Hsu, Chih-Jen Yang | 2005-12-27 |