Issued Patents All Time
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9548254 | Packaged semiconductor chips with array | Andrey Grinman, David Ovrutsky, Vage Oganesian | 2017-01-17 |
| 9070678 | Packaged semiconductor chips with array | Andrey Grinman, David Ovrutsky, Vage Oganesian | 2015-06-30 |
| 8704347 | Packaged semiconductor chips | Andrey Grinman, David Ovrutsky, Belgacem Haba, Vage Oganesian | 2014-04-22 |
| 8653644 | Packaged semiconductor chips with array | Andrey Grinman, David Ovrutsky, Vage Oganesian | 2014-02-18 |
| 8569876 | Packaged semiconductor chips with array | Andrey Grinman, David Ovrutsky, Vage Oganesian | 2013-10-29 |
| 8053281 | Method of forming a wafer level package | Kenneth Honer, Belgacem Haba, David Ovrutsky, Guilian Gao | 2011-11-08 |
| 7935568 | Wafer-level fabrication of lidded chips with electrodeposited dielectric coating | Vage Oganesian, David Ovrutsky, Belgacem Haba, Giles Humpston | 2011-05-03 |
| 7936062 | Wafer level chip packaging | Giles Humpston, Michael J. Nystrom, Vage Oganesian, Yulia Aksenton, Osher Avsian +7 more | 2011-05-03 |
| 7807508 | Wafer-level fabrication of lidded chips with electrodeposited dielectric coating | Vage Oganesian, Andrey Grinman, Felix Hazanovich, David Ovrutsky, Avi Dayan +2 more | 2010-10-05 |
| 7791199 | Packaged semiconductor chips | Andrey Grinman, David Ovrutsky, Belgacem Haba, Vage Oganesian | 2010-09-07 |